High temperature packaging for SAW transponder

R. Fachberger; J. Bardong

doi:10.1109/FREQ.2010.5556325

High temperature packaging for SAW transponder

R. Fachberger, J. Bardong

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Abstract

A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

Original language	English
Title of host publication	2010 IEEE International Frequency Control Symposium
Pages	287-290
Number of pages	4
DOIs	https://doi.org/10.1109/FREQ.2010.5556325
Publication status	Published - 4 Jun 2010
Externally published	Yes
Event	2010 IEEE International Frequency Control Symposium - Newport Beach, CA, USA Duration: 1 Jun 2010 → 4 Jun 2010

Conference

Conference	2010 IEEE International Frequency Control Symposium
Period	1/06/10 → 4/06/10

Keywords

Aging
Adhesives
Temperature measurement
Metals
Force
Crystals
Surface acoustic waves

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10.1109/FREQ.2010.5556325

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5556325

Cite this

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title = "High temperature packaging for SAW transponder",

abstract = "A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.",

keywords = "Aging, Adhesives, Temperature measurement, Metals, Force, Crystals, Surface acoustic waves",

author = "R. Fachberger and J. Bardong",

year = "2010",

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doi = "10.1109/FREQ.2010.5556325",

language = "English",

isbn = "978-1-4244-6400-5",

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AU - Bardong, J.

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N2 - A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

AB - A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

KW - Aging

KW - Adhesives

KW - Temperature measurement

KW - Metals

KW - Force

KW - Crystals

KW - Surface acoustic waves

UR - https://ieeexplore.ieee.org/document/5556325/

U2 - 10.1109/FREQ.2010.5556325

DO - 10.1109/FREQ.2010.5556325

M3 - Conference Paper

SN - 978-1-4244-6400-5

SP - 287

EP - 290

BT - 2010 IEEE International Frequency Control Symposium

T2 - 2010 IEEE International Frequency Control Symposium

Y2 - 1 June 2010 through 4 June 2010

ER -

High temperature packaging for SAW transponder

Abstract

Conference

Keywords

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