High temperature packaging for SAW transponder

R. Fachberger; J. Bardong

doi:10.1109/FREQ.2010.5556325

High temperature packaging for SAW transponder

R. Fachberger, J. Bardong

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Abstract

A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

Originalsprache	Englisch
Titel	2010 IEEE International Frequency Control Symposium
Seiten	287-290
Seitenumfang	4
DOIs	https://doi.org/10.1109/FREQ.2010.5556325
Publikationsstatus	Veröffentlicht - 4 Juni 2010
Extern publiziert	Ja
Veranstaltung	2010 IEEE International Frequency Control Symposium - Newport Beach, CA, USA Dauer: 1 Juni 2010 → 4 Juni 2010

Konferenz

Konferenz	2010 IEEE International Frequency Control Symposium
Zeitraum	1/06/10 → 4/06/10

Zugriff auf Dokument

10.1109/FREQ.2010.5556325

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5556325

Andere Dateien und Links

https://ieeexplore.ieee.org/document/5556325/

Dieses zitieren

@inproceedings{bb43fe1e8aad45af8c953bf01694552b,

title = "High temperature packaging for SAW transponder",

abstract = "A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.",

keywords = "Aging, Adhesives, Temperature measurement, Metals, Force, Crystals, Surface acoustic waves",

author = "R. Fachberger and J. Bardong",

year = "2010",

month = jun,

day = "4",

doi = "10.1109/FREQ.2010.5556325",

language = "English",

isbn = "978-1-4244-6400-5",

pages = "287--290",

booktitle = "2010 IEEE International Frequency Control Symposium",

note = "2010 IEEE International Frequency Control Symposium ; Conference date: 01-06-2010 Through 04-06-2010",

}

TY - GEN

T1 - High temperature packaging for SAW transponder

AU - Fachberger, R.

AU - Bardong, J.

PY - 2010/6/4

Y1 - 2010/6/4

N2 - A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

AB - A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.

KW - Aging

KW - Adhesives

KW - Temperature measurement

KW - Metals

KW - Force

KW - Crystals

KW - Surface acoustic waves

UR - https://ieeexplore.ieee.org/document/5556325/

U2 - 10.1109/FREQ.2010.5556325

DO - 10.1109/FREQ.2010.5556325

M3 - Conference Paper

SN - 978-1-4244-6400-5

SP - 287

EP - 290

BT - 2010 IEEE International Frequency Control Symposium

T2 - 2010 IEEE International Frequency Control Symposium

Y2 - 1 June 2010 through 4 June 2010

ER -

High temperature packaging for SAW transponder

Abstract

Konferenz

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Dieses zitieren