Original language | English |
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Title of host publication | 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) |
DOIs | |
Publication status | Published - 2019 |
Externally published | Yes |
Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application
Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review