Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
DOIs	https://doi.org/10.1109/S3S46989.2019.9320723
Publikationsstatus	Veröffentlicht - 2019
Extern publiziert	Ja

Zugriff auf Dokument

@inproceedings{fa8a7196b9614bccb90ca2bfc3edbb20,

title = "Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application",

author = "Sherjeel Khan",

year = "2019",

doi = "10.1109/S3S46989.2019.9320723",

language = "English",

booktitle = "2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)",

}