Original language | English |
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Journal | Nanotechnology |
DOIs | |
Publication status | Published - 2017 |
HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
S. Banerjee, D. Bülz, D. Solonenko, D. Reuter, C. Deibel, K. Hiller, D.R.T. Zahn, G. Salvan
Research output: Contribution to journal › Article › peer-review