Design of monolithic band-pass filter using high performance passive and active component technology for WLAN applications

Jingfeng Ding; Andreas Springer; Thomas Bartl; Gernot Hueber; Richard Hagelauer

doi:10.23919/EUMC.2010.5616360

Design of monolithic band-pass filter using high performance passive and active component technology for WLAN applications

Jingfeng Ding, Andreas Springer, Thomas Bartl, Gernot Hueber, Richard Hagelauer

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Abstract

The trend for low-cost, small dimension, thin profile, multi-function and multi-mode handheld wireless devices are required by the future user. In this paper, we present the design of an Electrostatic Discharge (ESD)-protection free band-pass filter (BPF) in an improved high resistivity silicon copper technology for the monolithic integration of active and passive devices. Inter-digital metal capacitors instead of typical Metal-Isolator-Metal (MIM) capacitors are used for better quality factor and higher breakdown voltage of up to 800 V. Electromagnetic (EM) simulation was extensively used in this design for inductor and filter optimization. The fabricated device by the first run has an insertion loss of less than 2 dB and an out of band attenuation of more than 25 dB for the WLAN 2.4 GHz frequency band and features a size of 1.0×1.3 mm².

Original language	English
Title of host publication	The 40th European Microwave Conference
Publisher	IEEE Computer Society
Pages	557-560
Number of pages	4
ISBN (Print)	978-2-87487-016-3
DOIs	https://doi.org/10.23919/EUMC.2010.5616360
Publication status	Published - 30 Sept 2010
Externally published	Yes
Event	The 40th European Microwave Conference - Paris, France Duration: 28 Sept 2010 → 30 Sept 2010

Conference

Conference	The 40th European Microwave Conference
Period	28/09/10 → 30/09/10

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10.23919/EUMC.2010.5616360

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5616360

Cite this

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title = "Design of monolithic band-pass filter using high performance passive and active component technology for WLAN applications",

abstract = "The trend for low-cost, small dimension, thin profile, multi-function and multi-mode handheld wireless devices are required by the future user. In this paper, we present the design of an Electrostatic Discharge (ESD)-protection free band-pass filter (BPF) in an improved high resistivity silicon copper technology for the monolithic integration of active and passive devices. Inter-digital metal capacitors instead of typical Metal-Isolator-Metal (MIM) capacitors are used for better quality factor and higher breakdown voltage of up to 800 V. Electromagnetic (EM) simulation was extensively used in this design for inductor and filter optimization. The fabricated device by the first run has an insertion loss of less than 2 dB and an out of band attenuation of more than 25 dB for the WLAN 2.4 GHz frequency band and features a size of 1.0×1.3 mm2.",

author = "Jingfeng Ding and Andreas Springer and Thomas Bartl and Gernot Hueber and Richard Hagelauer",

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doi = "10.23919/EUMC.2010.5616360",

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note = "The 40th European Microwave Conference ; Conference date: 28-09-2010 Through 30-09-2010",

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AU - Ding, Jingfeng

AU - Springer, Andreas

AU - Bartl, Thomas

AU - Hueber, Gernot

AU - Hagelauer, Richard

PY - 2010/9/30

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N2 - The trend for low-cost, small dimension, thin profile, multi-function and multi-mode handheld wireless devices are required by the future user. In this paper, we present the design of an Electrostatic Discharge (ESD)-protection free band-pass filter (BPF) in an improved high resistivity silicon copper technology for the monolithic integration of active and passive devices. Inter-digital metal capacitors instead of typical Metal-Isolator-Metal (MIM) capacitors are used for better quality factor and higher breakdown voltage of up to 800 V. Electromagnetic (EM) simulation was extensively used in this design for inductor and filter optimization. The fabricated device by the first run has an insertion loss of less than 2 dB and an out of band attenuation of more than 25 dB for the WLAN 2.4 GHz frequency band and features a size of 1.0×1.3 mm2.

AB - The trend for low-cost, small dimension, thin profile, multi-function and multi-mode handheld wireless devices are required by the future user. In this paper, we present the design of an Electrostatic Discharge (ESD)-protection free band-pass filter (BPF) in an improved high resistivity silicon copper technology for the monolithic integration of active and passive devices. Inter-digital metal capacitors instead of typical Metal-Isolator-Metal (MIM) capacitors are used for better quality factor and higher breakdown voltage of up to 800 V. Electromagnetic (EM) simulation was extensively used in this design for inductor and filter optimization. The fabricated device by the first run has an insertion loss of less than 2 dB and an out of band attenuation of more than 25 dB for the WLAN 2.4 GHz frequency band and features a size of 1.0×1.3 mm2.

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U2 - 10.23919/EUMC.2010.5616360

DO - 10.23919/EUMC.2010.5616360

M3 - Conference Paper

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BT - The 40th European Microwave Conference

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T2 - The 40th European Microwave Conference

Y2 - 28 September 2010 through 30 September 2010

ER -

Design of monolithic band-pass filter using high performance passive and active component technology for WLAN applications

Abstract

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