Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions

Research output: Conference proceeding/Chapter in Book/Report/Conference Paperpeer-review

Abstract

Thermal management becomes critical as loss-related component parameters become more highly temperature dependent. Although thermal simulation based on component losses is common, this work proposes closing the loop between electrical and thermal simulations with a transient system-level approach; enabling temperature dependent component parameters during circuit simulation. For a boost converter, the overall system efficiency and component losses are estimated by combining circuit simulation with the corresponding temperature distribution calculated with transient 3D-FVM. Simulations demonstrate how the overall system efficiency is influenced by the component temperature, especially during transient processes e.g. the system start up. Using the proposed co-simulation approach the temperature on one semiconductor surface could be estimated with good accordance to measured temperatures (+3.1 %/2.68 °C) during 60 s of transient start up.
Original languageGerman (Austria)
Title of host publication2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Pages1-6
Number of pages6
DOIs
Publication statusPublished - 27 Sep 2019
Event2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy
Duration: 25 Sep 201927 Sep 2019

Conference

Conference2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Period25/09/1927/09/19

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