Abstract
Thermal management becomes critical as loss-related component parameters become more highly temperature dependent. Although thermal simulation based on component losses is common, this work proposes closing the loop between electrical and thermal simulations with a transient system-level approach; enabling temperature dependent component parameters during circuit simulation. For a boost converter, the overall system efficiency and component losses are estimated by combining circuit simulation with the corresponding temperature distribution calculated with transient 3D-FVM. Simulations demonstrate how the overall system efficiency is influenced by the component temperature, especially during transient processes e.g. the system start up. Using the proposed co-simulation approach the temperature on one semiconductor surface could be estimated with good accordance to measured temperatures (+3.1 %/2.68 °C) during 60 s of transient start up.
Originalsprache | Deutsch (Österreich) |
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Titel | 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
Seiten | 1-6 |
Seitenumfang | 6 |
DOIs | |
Publikationsstatus | Veröffentlicht - 27 Sep. 2019 |
Veranstaltung | 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy Dauer: 25 Sep. 2019 → 27 Sep. 2019 |
Konferenz
Konferenz | 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
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Zeitraum | 25/09/19 → 27/09/19 |
Schlagwörter
- Integrated circuit modeling
- Temperature measurement
- Temperature dependence
- Circuit simulation
- Transient analysis
- Computational modeling
- Conferences