Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Advanced Engineering Materials
DOIs	https://doi.org/10.1002/adem.201900043
Publication status	Published - 2019
Externally published	Yes

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title = "Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications",

author = "Sherjeel Khan",

year = "2019",

doi = "10.1002/adem.201900043",

language = "English",

journal = "Advanced Engineering Materials",

issn = "1527-2648",

publisher = "Wiley-VCH Verlag",

}

TY - JOUR

T1 - Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications

AU - Khan, Sherjeel

PY - 2019

Y1 - 2019

UR - http://hdl.handle.net/10754/652447

U2 - 10.1002/adem.201900043

DO - 10.1002/adem.201900043

M3 - Article

SN - 1527-2648

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

ER -