Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Fachzeitschrift	Advanced Engineering Materials
DOIs	https://doi.org/10.1002/adem.201900043
Publikationsstatus	Veröffentlicht - 2019
Extern publiziert	Ja

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title = "Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications",

author = "Sherjeel Khan",

year = "2019",

doi = "10.1002/adem.201900043",

language = "English",

journal = "Advanced Engineering Materials",

issn = "1527-2648",

publisher = "Wiley-VCH Verlag",

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TY - JOUR

T1 - Bi-Facial Substrates Enabled Heterogeneous Multi-Dimensional Integrated Circuits (MD-IC) for Internet of Things (IoT) Applications

AU - Khan, Sherjeel

PY - 2019

Y1 - 2019

UR - http://hdl.handle.net/10754/652447

U2 - 10.1002/adem.201900043

DO - 10.1002/adem.201900043

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SN - 1527-2648

JO - Advanced Engineering Materials

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