Abstract
This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.
Original language | English |
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Title of host publication | 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE |
Pages | 1-4 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 25 Sept 2020 |
Event | 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy Duration: 23 Sept 2020 → 25 Sept 2020 |
Conference
Conference | 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE |
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Period | 23/09/20 → 25/09/20 |
Keywords
- Antenna measurements
- Impedance
- Antennas
- Copper
- Impedance measurement
- Electromagnetic compatibility
- Solid modeling