Benchmark for the Near-Field Problem: Simulation versus Measurement

Ralph Prestros; Karl Hollaus; Bernhard Auinger; Michael Leumüller

doi:10.1109/EMCEUROPE48519.2020.9245866

Benchmark for the Near-Field Problem: Simulation versus Measurement

Ralph Prestros, Karl Hollaus, Bernhard Auinger, Michael Leumüller

Coexistence & Electromagnetic Compatibility (CEMC)

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Abstract

This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.

Originalsprache	Englisch
Titel	2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
Seiten	1-4
Seitenumfang	4
DOIs	https://doi.org/10.1109/EMCEUROPE48519.2020.9245866
Publikationsstatus	Veröffentlicht - 25 Sep. 2020
Veranstaltung	2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy Dauer: 23 Sep. 2020 → 25 Sep. 2020

Konferenz

Konferenz	2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
Zeitraum	23/09/20 → 25/09/20

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10.1109/EMCEUROPE48519.2020.9245866

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9245866

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title = "Benchmark for the Near-Field Problem: Simulation versus Measurement",

abstract = "This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.",

keywords = "Antenna measurements, Impedance, Antennas, Copper, Impedance measurement, Electromagnetic compatibility, Solid modeling",

author = "Ralph Prestros and Karl Hollaus and Bernhard Auinger and Michael Leum{\"u}ller",

year = "2020",

month = sep,

day = "25",

doi = "10.1109/EMCEUROPE48519.2020.9245866",

language = "English",

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TY - GEN

T1 - Benchmark for the Near-Field Problem: Simulation versus Measurement

AU - Prestros, Ralph

AU - Hollaus, Karl

AU - Auinger, Bernhard

AU - Leumüller, Michael

PY - 2020/9/25

Y1 - 2020/9/25

N2 - This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.

AB - This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.

KW - Antenna measurements

KW - Impedance

KW - Antennas

KW - Copper

KW - Impedance measurement

KW - Electromagnetic compatibility

KW - Solid modeling

UR - https://ieeexplore.ieee.org/document/9245866/

U2 - 10.1109/EMCEUROPE48519.2020.9245866

DO - 10.1109/EMCEUROPE48519.2020.9245866

M3 - Conference Paper

SN - 978-1-7281-5580-7

SP - 1

EP - 4

BT - 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE

T2 - 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE

Y2 - 23 September 2020 through 25 September 2020

ER -

Benchmark for the Near-Field Problem: Simulation versus Measurement

Abstract

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