Abstract
Modern multi-band and multi-mode handheld wireless devices require novel approaches for the integration of passive elements into the radio front-end. In this paper, we present the design of an electrostatic discharge (ESD)-protection-free harmonic filter using an improved high-resistivity silicon copper technology for the monolithic integration of active and passive devices. Typical metal-isolator-metal (MIM) capacitors are replaced by inter-digital metal capacitors which provide a high breakdown voltage of up to 800 V. As the machine-mode ESD voltage is lower than 500 V, this filter can operate without ESD protection. In this design, electromagnetic (EM) simulation was used extensively for inductor and filter optimization. The fabricated device has an insertion loss of less than 0.3 dB and 2nd and 3rd harmonic attenuations of more than 30 dB for the WLAN 2.4 GHz frequency band and features a size of 0.75×0.67 mm2.
Original language | English |
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Title of host publication | 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) |
Publisher | IEEE Computer Society |
Pages | 228-231 |
Number of pages | 4 |
ISBN (Print) | 978-1-4244-5458-7 |
DOIs | |
Publication status | Published - 13 Jan 2010 |
Externally published | Yes |
Event | 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) - New Orleans, LA, USA Duration: 11 Jan 2010 → 13 Jan 2010 |
Conference
Conference | 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) |
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Period | 11/01/10 → 13/01/10 |
Keywords
- Harmonic filters
- Wireless LAN
- Electrostatic discharge
- MIM capacitors
- Silicon
- Copper
- Monolithic integrated circuits
- Breakdown voltage
- Protection
- Electromagnetic induction