Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS

Xiaodong Hu; Piotr Mackowiak; Manuel Baeuscher; Yucheng Zhang; Bei Wang; Ulli Hansen; Simon Maus; Oliver Gyenge; Oswin Ehrmann; Klaus-Dieter Lang; Ha-Duong Ngo

doi:10.1109/EPTC.2018.8654362

Low Stress Solution of Anodic Bonding Technology with SW-YY^® Glass for Sensitive MEMS

Xiaodong Hu, Piotr Mackowiak, Manuel Baeuscher, Yucheng Zhang, Bei Wang, Ulli Hansen, Simon Maus, Oliver Gyenge, Oswin Ehrmann, Klaus-Dieter Lang, Ha-Duong Ngo

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel

Abstract

Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between silicon and glass during the anodic bonding process and its influence on MEMS-based sensors. For this purpose, SW-YY^® Glass from ASAHI is selected. Firstly, the SW-YY^® glass material is characterized in the bonding temperature range from 250°C to 500°C and voltage range from 400V-800V. Secondly, a MEMS based pressure sensor and two type glass substrates (SW-YY^®, Pyrex^®7740) were fabricated and bonded to evaluate the stress issue. Results show that the offset of the pressure sensor introduced by mismatched CTE was reduced significantly with SW-YY^® glass than standard Pyrex^® ®7740 glass. The proposed method can be used to reduce the influence of the internal stress caused with bonding temperature and the mismatched CTEs for stress sensitive MEMS.

Originalsprache	Englisch
Titel	2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
Seiten	251-255
Seitenumfang	5
DOIs	https://doi.org/10.1109/EPTC.2018.8654362
Publikationsstatus	Veröffentlicht - 7 Dez. 2018
Veranstaltung	2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore Dauer: 4 Dez. 2018 → 7 Dez. 2018

Konferenz

Konferenz	2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
Zeitraum	4/12/18 → 7/12/18

Zugriff auf Dokument

10.1109/EPTC.2018.8654362

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8654362

Andere Dateien und Links

https://ieeexplore.ieee.org/document/8654362/

Dieses zitieren

@inproceedings{312bf6814d154dad8089d61253380f00,

title = "Low Stress Solution of Anodic Bonding Technology with SW-YY{\textregistered} Glass for Sensitive MEMS",

abstract = "Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between silicon and glass during the anodic bonding process and its influence on MEMS-based sensors. For this purpose, SW-YY{\textregistered} Glass from ASAHI is selected. Firstly, the SW-YY{\textregistered} glass material is characterized in the bonding temperature range from 250°C to 500°C and voltage range from 400V-800V. Secondly, a MEMS based pressure sensor and two type glass substrates (SW-YY{\textregistered}, Pyrex{\textregistered}7740) were fabricated and bonded to evaluate the stress issue. Results show that the offset of the pressure sensor introduced by mismatched CTE was reduced significantly with SW-YY{\textregistered} glass than standard Pyrex{\textregistered} {\textregistered}7740 glass. The proposed method can be used to reduce the influence of the internal stress caused with bonding temperature and the mismatched CTEs for stress sensitive MEMS.",

keywords = "Bonding, Glass, Silicon, Micromechanical devices, Stress, Pressure sensors",

author = "Xiaodong Hu and Piotr Mackowiak and Manuel Baeuscher and Yucheng Zhang and Bei Wang and Ulli Hansen and Simon Maus and Oliver Gyenge and Oswin Ehrmann and Klaus-Dieter Lang and Ha-Duong Ngo",

year = "2018",

month = dec,

day = "7",

doi = "10.1109/EPTC.2018.8654362",

language = "English",

isbn = "978-1-5386-7669-1",

pages = "251--255",

booktitle = "2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)",

note = "2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ; Conference date: 04-12-2018 Through 07-12-2018",

}

Hu, X, Mackowiak, P, Baeuscher, M, Zhang, Y, Wang, B, Hansen, U, Maus, S, Gyenge, O, Ehrmann, O, Lang, K-D & Ngo, H-D 2018, Low Stress Solution of Anodic Bonding Technology with SW-YY^® Glass for Sensitive MEMS. in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)., 8654362, S. 251-255, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 4/12/18. https://doi.org/10.1109/EPTC.2018.8654362

TY - GEN

T1 - Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS

AU - Hu, Xiaodong

AU - Mackowiak, Piotr

AU - Baeuscher, Manuel

AU - Zhang, Yucheng

AU - Wang, Bei

AU - Hansen, Ulli

AU - Maus, Simon

AU - Gyenge, Oliver

AU - Ehrmann, Oswin

AU - Lang, Klaus-Dieter

AU - Ngo, Ha-Duong

PY - 2018/12/7

Y1 - 2018/12/7

N2 - Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between silicon and glass during the anodic bonding process and its influence on MEMS-based sensors. For this purpose, SW-YY® Glass from ASAHI is selected. Firstly, the SW-YY® glass material is characterized in the bonding temperature range from 250°C to 500°C and voltage range from 400V-800V. Secondly, a MEMS based pressure sensor and two type glass substrates (SW-YY®, Pyrex®7740) were fabricated and bonded to evaluate the stress issue. Results show that the offset of the pressure sensor introduced by mismatched CTE was reduced significantly with SW-YY® glass than standard Pyrex® ®7740 glass. The proposed method can be used to reduce the influence of the internal stress caused with bonding temperature and the mismatched CTEs for stress sensitive MEMS.

AB - Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between silicon and glass during the anodic bonding process and its influence on MEMS-based sensors. For this purpose, SW-YY® Glass from ASAHI is selected. Firstly, the SW-YY® glass material is characterized in the bonding temperature range from 250°C to 500°C and voltage range from 400V-800V. Secondly, a MEMS based pressure sensor and two type glass substrates (SW-YY®, Pyrex®7740) were fabricated and bonded to evaluate the stress issue. Results show that the offset of the pressure sensor introduced by mismatched CTE was reduced significantly with SW-YY® glass than standard Pyrex® ®7740 glass. The proposed method can be used to reduce the influence of the internal stress caused with bonding temperature and the mismatched CTEs for stress sensitive MEMS.

KW - Bonding

KW - Glass

KW - Silicon

KW - Micromechanical devices

KW - Stress

KW - Pressure sensors

UR - https://ieeexplore.ieee.org/document/8654362/

U2 - 10.1109/EPTC.2018.8654362

DO - 10.1109/EPTC.2018.8654362

M3 - Conference Paper

SN - 978-1-5386-7669-1

SP - 251

EP - 255

BT - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

T2 - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

Y2 - 4 December 2018 through 7 December 2018

ER -