Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS

Xiaodong Hu, Piotr Mackowiak, Manuel Baeuscher, Yucheng Zhang, Bei Wang, Ulli Hansen, Simon Maus, Oliver Gyenge, Oswin Ehrmann, Klaus-Dieter Lang, Ha-Duong Ngo

    Research output: Conference proceeding/Chapter in Book/Report/Conference Paper

    Abstract

    Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between silicon and glass during the anodic bonding process and its influence on MEMS-based sensors. For this purpose, SW-YY® Glass from ASAHI is selected. Firstly, the SW-YY® glass material is characterized in the bonding temperature range from 250°C to 500°C and voltage range from 400V-800V. Secondly, a MEMS based pressure sensor and two type glass substrates (SW-YY®, Pyrex®7740) were fabricated and bonded to evaluate the stress issue. Results show that the offset of the pressure sensor introduced by mismatched CTE was reduced significantly with SW-YY® glass than standard Pyrex® ®7740 glass. The proposed method can be used to reduce the influence of the internal stress caused with bonding temperature and the mismatched CTEs for stress sensitive MEMS.
    Original languageEnglish
    Title of host publication2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
    Pages251-255
    Number of pages5
    DOIs
    Publication statusPublished - 7 Dec 2018
    Event2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore
    Duration: 4 Dec 20187 Dec 2018

    Conference

    Conference2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
    Period4/12/187/12/18

    Keywords

    • Bonding
    • Glass
    • Silicon
    • Micromechanical devices
    • Stress
    • Pressure sensors

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