Original language | English |
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Title of host publication | Proceedings of SPIE - The International Society for Optical Engineering |
DOIs | |
Publication status | Published - 2015 |
Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy
T. Arnold, W. Muehleisen, J. Schicker, C. Hirschl
Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review