High temperature MEMS packages: die-attach solutions for LiNbO3 under low bonding pressures

Physik & Astronomy

• microelectromechanical systems 100%
• silver 67%
• assemblies 42%
• adhesives 40%
• failure analysis 27%
• shear strength 23%
• solders 23%
• integrity 21%
• test equipment 21%
• lithium niobates 21%
• eutectics 19%
• intermetallics 18%
• low pressure 17%
• microscopy 14%
• shear 14%
• mechanical properties 13%
• single crystals 12%