Abstract
The invention relates to a device with a gripper for the handling of sheets, in particular for handling of thin wafers with a receiving plate with nozzle bores for generating a hydrodynamic negative pressure, wherein the receiving plate has mechanical end stops which engage on the ojbect to handle and fix it in position.
Originalsprache | Englisch |
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Veröffentlichungsnummer | DE10144409A1 |
Publikationsstatus | Veröffentlicht - Sep. 2001 |