Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications

Sarah Risquez, Marion Woytasik, Jie Wei, Fabien Parrain, Elie Lefeuvre

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
DOIs	https://doi.org/10.1109/dtip.2015.7160963
Publikationsstatus	Veröffentlicht - Apr. 2015

Zugriff auf Dokument

@inproceedings{05a4a750db8c44ca889718064f9b52ee,

title = "Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications",

author = "Sarah Risquez and Marion Woytasik and Jie Wei and Fabien Parrain and Elie Lefeuvre",

year = "2015",

month = apr,

doi = "10.1109/dtip.2015.7160963",

language = "English",

booktitle = "2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)",

}

TY - GEN

T1 - Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications

AU - Risquez, Sarah

AU - Woytasik, Marion

AU - Wei, Jie

AU - Parrain, Fabien

AU - Lefeuvre, Elie

PY - 2015/4

Y1 - 2015/4

U2 - 10.1109/dtip.2015.7160963

DO - 10.1109/dtip.2015.7160963

M3 - Conference Paper

BT - 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

ER -