Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications

Sarah Risquez, Marion Woytasik, Jie Wei, Fabien Parrain, Elie Lefeuvre

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Original language	English
Title of host publication	2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
DOIs	https://doi.org/10.1109/dtip.2015.7160963
Publication status	Published - Apr 2015

Access to Document

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title = "Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications",

author = "Sarah Risquez and Marion Woytasik and Jie Wei and Fabien Parrain and Elie Lefeuvre",

year = "2015",

month = apr,

doi = "10.1109/dtip.2015.7160963",

language = "English",

booktitle = "2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)",

}

TY - GEN

T1 - Design of a 3D multilayer out-of-plane overlap electrostatic energy harvesting MEMS for medical implant applications

AU - Risquez, Sarah

AU - Woytasik, Marion

AU - Wei, Jie

AU - Parrain, Fabien

AU - Lefeuvre, Elie

PY - 2015/4

Y1 - 2015/4

U2 - 10.1109/dtip.2015.7160963

DO - 10.1109/dtip.2015.7160963

M3 - Conference Paper

BT - 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

ER -