Descrambling of embedded SRAM using a laser probe

S. Chef, C.T. Chua, J.Y. Tay, Y.W. Siah, S. Bhasin, J. Breier, C.L. Gan

Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

Originalsprache	Englisch
Titel	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
DOIs	https://doi.org/10.1109/IPFA.2018.8452604
Publikationsstatus	Veröffentlicht - 2018

Zugriff auf Dokument

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title = "Descrambling of embedded SRAM using a laser probe",

author = "S. Chef and C.T. Chua and J.Y. Tay and Y.W. Siah and S. Bhasin and J. Breier and C.L. Gan",

year = "2018",

doi = "10.1109/IPFA.2018.8452604",

language = "English",

booktitle = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

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AU - Chua, C.T.

AU - Tay, J.Y.

AU - Siah, Y.W.

AU - Bhasin, S.

AU - Breier, J.

AU - Gan, C.L.

PY - 2018

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DO - 10.1109/IPFA.2018.8452604

M3 - Conference Paper

BT - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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