Original language | English |
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Title of host publication | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
DOIs | |
Publication status | Published - 2018 |
Descrambling of embedded SRAM using a laser probe
S. Chef, C.T. Chua, J.Y. Tay, Y.W. Siah, S. Bhasin, J. Breier, C.L. Gan
Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review