Wafer-level vacuum package of two-dimensional micro-scanner

H.M. Chu, T. Sasaki, K. Hane

Research output: Contribution to journal › Article › peer-review

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TY - JOUR

T1 - Wafer-level vacuum package of two-dimensional micro-scanner

AU - Chu, H.M.

AU - Sasaki, T.

AU - Hane, K.

PY - 2018

Y1 - 2018

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85038086096&partnerID=MN8TOARS

U2 - 10.1007/s00542-017-3668-2

DO - 10.1007/s00542-017-3668-2

M3 - Artikel

SN - 0946-7076

JO - Microsystem Technologies

JF - Microsystem Technologies

ER -