Varifocal Scanner Using Wafer Bonding

K. Nakazawa, T. Sasaki, H. Furuta, J. Kamiya, T. Kamiya, K. Hane

Research output: Contribution to journal › Article › peer-review

Original language	Undefined/Unknown
Journal	Journal of Microelectromechanical Systems
DOIs	https://doi.org/10.1109/JMEMS.2017.2661979
Publication status	Published - 2017

Access to Document

TY - JOUR

T1 - Varifocal Scanner Using Wafer Bonding

AU - Nakazawa, K.

AU - Sasaki, T.

AU - Furuta, H.

AU - Kamiya, J.

AU - Kamiya, T.

AU - Hane, K.

PY - 2017

Y1 - 2017

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85013350276&partnerID=MN8TOARS

U2 - 10.1109/JMEMS.2017.2661979

DO - 10.1109/JMEMS.2017.2661979

M3 - Artikel

SN - 1057-7157

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

ER -