Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

Sherjeel Khan; Narendiran Anandan; Hubert Zangl; Jürgen Kosel

Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

Sherjeel Khan, Narendiran Anandan, Hubert Zangl, Jürgen Kosel

Sensor Applications (SEA)

Research output: Contribution to conference (No Proceedings) › Abstract › peer-review

Original language	English
Publication status	Published - 2 Mar 2023
Event	LOPEC Conference 2023: Driving the future of printed electronics - ICM – International Congress Center München, München, Germany Duration: 28 Feb 2023 → 2 Mar 2023 https://lopec.com/en/

Conference

Conference	LOPEC Conference 2023
Country/Territory	Germany
City	München
Period	28/02/23 → 2/03/23
Internet address	https://lopec.com/en/

Cite this

@conference{6726f853d9c44516a1ab62a1d842fee2,

title = "Through-polymer-vias for electrical interconnection between multiple layers in printed electronics",

author = "Sherjeel Khan and Narendiran Anandan and Hubert Zangl and J{\"u}rgen Kosel",

year = "2023",

month = mar,

day = "2",

language = "English",

note = "LOPEC Conference 2023 ; Conference date: 28-02-2023 Through 02-03-2023",

url = "https://lopec.com/en/",

}

TY - CONF

T1 - Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

AU - Khan, Sherjeel

AU - Anandan, Narendiran

AU - Zangl, Hubert

AU - Kosel, Jürgen

PY - 2023/3/2

Y1 - 2023/3/2

UR - https://lopec.com/application/en/program/lopec-conference/lecture/through-polymer-vias-for-electrical-interconnection-between-multiple-layers-in-printed-electronics-1068

M3 - Abstract

T2 - LOPEC Conference 2023

Y2 - 28 February 2023 through 2 March 2023

ER -

Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

Conference

Other files and links

Cite this