Abstract
Downscaled semiconductors are at risk of CDM like ESD events during manufacturing, packaging, testing and placement. The reduction in silicon area spent for ESD protection circuits in modern ICs makes the devices more vulnerable by reducing damaging thresholds. Following this trend in industry it is getting more crucial to monitor ESD in processes where these devices are handled. A new type of sensor using multiple antennas along a coax-cable is used to locate CDM like ESD events. Due to the large quantity of antennas, this sensor has the potential to be used in more complex environments where a line of sight is not necessary for all antennas. The localization is performed based on an algorithm which compares the measured signal with a reference dataset from simulation. A hardware implementation together with a stepwise derivation of the algorithm is described. Evaluation of the system in an initial setup is showing encouraging performance for the localization.
Original language | English |
---|---|
Title of host publication | 2023 International Symposium on Electromagnetic Compatibility – EMC Europe |
Pages | 1-6 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 8 Sept 2023 |
Externally published | Yes |
Event | 2023 International Symposium on Electromagnetic Compatibility – EMC Europe - Krakow, Poland Duration: 4 Sept 2023 → 8 Sept 2023 |
Conference
Conference | 2023 International Symposium on Electromagnetic Compatibility – EMC Europe |
---|---|
Period | 4/09/23 → 8/09/23 |
Keywords
- Location awareness
- Semiconductor device measurement
- Packaging
- Electromagnetic compatibility
- Market research
- Silicon
- Manufacturing