C4.4 - Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements

K. Erbacher, C. Bourquard, O. Lokesh, L. Wu, P. Mackowiak, M. Schneider-Ramelow,, H. Ngo

Research output: Contribution to conference (No Proceedings) › Paper › peer-review

Original language	English
Pages	171-172
DOIs	https://doi.org/10.5162/SMSI2023/C4.4
Publication status	Published - 2023
Event	SMSI 2023 - Nürnberg Duration: 8 May 2023 → 11 May 2023

Conference	SMSI 2023
Period	8/05/23 → 11/05/23

Access to Document

@conference{71b65f96dcde46028d7916ca2e4d52fa,

title = "C4.4 - Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements",

author = "K. Erbacher and C. Bourquard and O. Lokesh and L. Wu and P. Mackowiak and M. Schneider-Ramelow, and H. Ngo",

year = "2023",

doi = "10.5162/SMSI2023/C4.4",

language = "English",

pages = "171--172",

note = "SMSI 2023 ; Conference date: 08-05-2023 Through 11-05-2023",

}

TY - CONF

T1 - C4.4 - Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements

AU - Erbacher, K.

AU - Bourquard, C.

AU - Lokesh, O.

AU - Wu, L.

AU - Mackowiak, P.

AU - Schneider-Ramelow,, M.

AU - Ngo, H.

PY - 2023

Y1 - 2023

U2 - 10.5162/SMSI2023/C4.4

DO - 10.5162/SMSI2023/C4.4

M3 - Paper

SP - 171

EP - 172

T2 - SMSI 2023

Y2 - 8 May 2023 through 11 May 2023

ER -