Application and optimization of stiffness abruption structures for pressure sensors with high sensitivity and anti-overload ability

Tingzhong Xu, Dejiang Lu, Libo Zhao, Zhuangde Jiang, Hongyan Wang, Xin Guo, Zhikang Li, Xiangyang Zhou, Yulong Zhao

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The influence of diaphragm bending stiffness distribution on the stress concentration characteristics of a pressure sensing chip had been analyzed and discussed systematically. According to the analysis, a novel peninsula-island-based diaphragm structure was presented and applied to two differenet diaphragm shapes as sensing chips for pressure sensors. By well-designed bending stiffness distribution of the diaphragm, the elastic potential energy induced by diaphragm deformation was concentrated above the gap position, which remarkably increased the sensitivity of the sensing chip. An optimization method and the distribution pattern of the peninsula-island based diaphragm structure were also discussed. Two kinds of sensing chips combined with the peninsula-island structures distributing along the side edge and diagonal directions of rectangular diaphragm were fabricated and analyzed. By bonding the sensing chips with anti-overload glass bases, these two sensing chips were demonstrated by testing to achieve not only high sensitivity, but also good anti-overload ability. The experimental results showed that the proposed structures had the potential to measure ultra-low absolute pressures with high sensitivity and good anti-overload ability in an atmospheric environment.
    Original languageEnglish
    JournalSensors
    Volume17
    Issue number9
    DOIs
    Publication statusPublished - 1 Sept 2017

    Keywords

    • Bending stiffness distribution
    • High anti-overload ability
    • High sensitivity
    • Peninsula-island structured diaphragm
    • Stress concentration region

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