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Keyphrases
3D Finite Element Analysis
22%
Box System
33%
Ceramic Capacitors
16%
Component-based Modeling
16%
Cooling System
22%
Cross-coupling
33%
Datasheet Information
16%
Design Phase
16%
Device Power
16%
Electrical Characterization
16%
Electronic System Design
16%
Essential Model
16%
Frequency Response Function
16%
Geometric Features
16%
Heat Dissipating
16%
Heat Transfer Model
16%
High Power Density
83%
Integrated System Design
33%
Junction Temperature Estimation
33%
Junction Temperature Monitoring
33%
Loss Density
16%
Mechanical Investigation
33%
Model Features
16%
Modeling Process
16%
Non-uniform Temperature Distribution
16%
On-board Charger
66%
Optical Fiber Sensing
33%
Optimal Heat Transfer
22%
Package Modeling
16%
Power Box
66%
Power Converter
16%
Power Density
22%
Power Electronic Systems
66%
Power Electronics Cooling
16%
Power Electronics Modeling
16%
Power Semiconductor
16%
Power Semiconductor Devices
16%
Power Semiconductor Package
27%
Printed Circuit Board
27%
RC Thermal Model
16%
Self-impedance
16%
Semiconductor Components
33%
Semiconductor Switches
16%
Simulation Model
33%
System Modeling
22%
Thermal Interaction
16%
Thermal Investigation
33%
Thermo-mechanical Loading
33%
Thermomechanical
33%
Wirebond Interconnect
16%
Engineering
Automotive Application
8%
Automotives
33%
Component Model
8%
Cooling Device
11%
Cooling System
69%
Cross-Coupling
33%
Datasheet
16%
Design Phase
16%
Design Process
11%
Electric Vehicle
16%
Electrical System
11%
Feature Model
16%
Finite Element Method
25%
Frequency Response Function
16%
Geometric Feature
16%
Grid Voltage
8%
Heat Distribution
13%
Heat Extraction
11%
Heat Flux
11%
Heat Flux Density
11%
Heat Removal
11%
High Integration Density
11%
Hot Spot
8%
Illustrates
11%
Interconnects
16%
Junction Temperature
33%
Led Package
11%
Liquid Cooling
8%
Material Interface
11%
Mechanical Loading
33%
Mechanical Stress
11%
On-Board Charger
55%
Part Count
8%
Power Converter
16%
Power Density
100%
Power Device
19%
Power Electronics
77%
Power Engineering
11%
Printed Circuit Board
27%
Real System
8%
Semiconductor Device
16%
Simulation Result
16%
Surface Mount Technology
11%
Switching Frequency
11%
System Designer
8%
System Volume
11%
Temperature Estimation
50%
Thermal Characterization
11%
Thermal Performance
16%
Wide Bandgap Semiconductor
11%
