Executive Management

Projects

Projects per year 2015 2019 2022

• 17 Finished

Projects per year

Search results

• Finished

  ASSIC-3.5: ASSIC - Project 3.5 Smart Systems Solutions of the Future

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Kriging 100%
  • Sensing 86%
  • Environmental Monitoring 70%
  • Composite Likelihood 61%
  • Monitoring 59%

• ASSIC-3.4: ASSIC - Project 3.4 Smart Systems Solutions for Energy Storage and Energy Distribution Systems

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

• ASSIC-1.6: ASSIC - Project 1.6 Advanced MEMS Sensors and Transducers

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • transducers 100%
  • actuation 49%
  • chips 37%
  • acoustics 33%
  • performance 31%

• ASSIC-2.1: ASSIC - Project 2.1 Waferlevel Packages

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • wafers 100%
  • gyroscopes 73%
  • packaging 69%
  • ellipsometry 65%
  • microelectromechanical systems 64%

• ASSIC-3.1: ASSIC - Project 3.1 Smart Systems Solutions for Micro- and Nano-sized Contaminats

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Raman spectroscopy 100%
  • chips 81%
  • stress analysis 70%
  • Assays 68%
  • Fluorescence 67%

• ASSIC-1.5: ASSIC - Project 1.5 MEMS Microfabrication Technology

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • transducers 100%
  • chips 78%
  • silicon 44%
  • harmonics 35%
  • low frequencies 28%

• ASSIC-2.3: ASSIC - Project 2.3 Multifunctional Integrated Systems

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

• ASSIC-2.4: ASSIC - Project 2.4 Harsh Environment Sensors

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

• ASSIC-1.2: ASSIC - Project 1.2 MEMS Position Sensors

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Magnetic fields 100%
  • Calibration 61%
  • Systems analysis 60%
  • Motion tracking 49%
  • Fabrication 44%

• ASSIC-1.3: ASSIC - Project 1.3 RF-MEMS

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • hafnium 100%
  • seeds 74%
  • solid solutions 66%
  • thin films 57%
  • microstructure 52%

• ASSIC-1.4: ASSIC - Project 1.4 Environmental MEMS Sensors

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Plasmons 100%
  • Plasmon 65%
  • Slab Like Crystal 64%
  • Waveguides 57%
  • Resonators 53%

• ASSIC-3.3: ASSIC - Project 3.3 Smart Systems Solutions for Industrial Process Analytics and Process Control

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • YAG lasers 100%
  • Q switched lasers 77%
  • high power lasers 53%
  • ignition 53%
  • lasers 42%

• ASSIC-3.2: ASSIC - Project 3.2 Smart Systems Solutions for Food and Kitchen Appliances

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Vegetables 100%
  • Fruits 89%
  • Smartphones 72%
  • Data recording 51%
  • Masks 36%

• ASSIC-2.2: ASSIC - Project 2.2 System in Package

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

• ASSIC-2.5: ASSIC - Project 2.5 Advanced Packaging Technologies

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

• ASSIC-1.1: ASSIC - Project 1.1 Magnetic MEMS Modelling

  Hirschl, C.

  1/01/19 → 31/12/22

  Project: Research

  • Magnetic fields 100%
  • Calibration 50%
  • Textbooks 40%
  • Convergence of numerical methods 40%
  • Fabrication 36%

• ASSIC: ASSIC Austrian Smart Systems Integration Research Center

  Hirschl, C.

  1/01/15 → 31/12/22

  Project: Research

  File

  • Magnetic fields 100%
  • Sensors 81%
  • sensors 70%
  • Evanescent fields 54%
  • chips 50%