Novel technology for handling very thin wafers

Alfred Binder; Gerhard Kroupa

Novel technology for handling very thin wafers

Photonic Systems (PHOS)

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Abstract

Increasing use of very thin, flexible wafers for IC manufacturing brings with it extremely challenging automated handling problems. Individually, vacuum- or Bernoulli-based end-effectors cannot solve all problems. But the combination of these two techniques in one end-effector design provides effective automated handling for several emerging applications.

Originalsprache	Englisch
Fachzeitschrift	Solid State Technology
Jahrgang	46
Ausgabenummer	10
Publikationsstatus	Veröffentlicht - Okt. 2003

Andere Dateien und Links

https://www.mendeley.com/catalogue/10670c8a-a92a-366f-94ba-e3b6a3ff5190/

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AB - Increasing use of very thin, flexible wafers for IC manufacturing brings with it extremely challenging automated handling problems. Individually, vacuum- or Bernoulli-based end-effectors cannot solve all problems. But the combination of these two techniques in one end-effector design provides effective automated handling for several emerging applications.

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Novel technology for handling very thin wafers

Abstract

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