Highly Selective Plasma Etching Technique for Molybdenum: Highly Selective Plasma Etching Technique for Molybdenum

Ingenieurwesen & Materialwissenschaft

• Plasma etching 100%
• Molybdenum 78%
• Etching 72%
• Photoresists 42%
• Masks 10%
• Inductively coupled plasma 8%
• Substrates 7%
• Plasmas 5%
• Temperature 4%

Physik & Astronomy

• plasma etching 75%
• molybdenum 66%
• etching 50%
• photoresists 35%
• selectivity 15%
• holders 12%
• masks 9%
• temperature 3%

Chemische Bestandteile

• Etching 60%
• Plasma 41%
• Holder 13%
• Pressure 6%
• Inductively Coupled Plasma 5%
• Liquid Film 2%