Condition monitoring of IGBT modules using online TSEPs and data-driven approach

Mathematik

• Condition Monitoring 100%
• Failure Mode 65%
• Data-driven 63%
• Training 59%
• Monitoring 43%
• Testing 39%
• Module 37%
• Classifier 31%
• Mechanical Stress 23%
• Power Electronics 22%
• Inverter 21%
• Support Vector 21%
• Repeatability 21%
• Experimental Analysis 20%
• Thermal Stress 19%
• Unit 19%
• Converter 19%
• Simulation Analysis 18%
• Chip 17%
• Operating Characteristics 17%
• Degradation 17%
• Descriptors 16%
• Fault 16%
• Numerical Analysis 13%
• Configuration 10%
• Numerical Simulation 10%

Ingenieurwesen & Materialwissenschaft

• Insulated gate bipolar transistors (IGBT) 61%
• Condition monitoring 58%
• Failure modes 36%
• Testing 28%
• Monitoring 23%
• Classifiers 19%
• Temperature 16%
• Units of measurement 15%
• Thermal stress 13%
• Power electronics 13%
• Wear of materials 10%
• Degradation 9%
• Computer simulation 7%