Ingenieurwesen & Materialwissenschaft
Artificial intelligence
6%
Automatic identification
12%
Balloons
6%
Bandwidth
8%
Cameras
37%
Cellular neural networks
27%
Clocks
8%
Communication
10%
Communication systems
9%
Computer hardware
27%
Continuous wave radar
7%
Controllers
5%
Convolutional neural networks
11%
Costs
8%
Data communication systems
9%
Data reduction
8%
Data storage equipment
14%
Data transfer
7%
Decomposition
15%
Deep learning
48%
Deep neural networks
71%
Defects
28%
Demonstrations
7%
Dynamic mechanical analysis
12%
Earth (planet)
17%
Electrocardiography
10%
Embedded systems
16%
Energy efficiency
24%
Engines
13%
Feature extraction
16%
Field programmable gate arrays (FPGA)
25%
Gesture recognition
12%
Heat conduction
7%
Heat transfer
14%
Hot Temperature
10%
Image classification
13%
Image sensors
22%
Imaging techniques
26%
Inspection
7%
Interfaces (computer)
9%
Kalman filters
19%
Learning algorithms
11%
Lighting
8%
Long short-term memory
17%
Machine learning
33%
Metal foil
5%
Microprocessor chips
9%
Multilayer neural networks
5%
Network architecture
38%
Network-on-chip
23%
Neural networks
100%
Object tracking
34%
Optimal systems
6%
Orthogonal frequency division multiplexing
37%
Palmprint recognition
29%
Particle accelerators
60%
Photons
12%
Pixels
15%
Power and Energy
12%
Program processors
8%
Quantum efficiency
16%
Radar
26%
Radar tracking
31%
Random forests
5%
Reduced instruction set computing
39%
Reinforcement learning
32%
Satellites
16%
Sensors
33%
Servers
7%
Signal processing
17%
Static random access storage
11%
System-on-chip
42%
Testbeds
30%
Testing
5%
Tomography
20%
Traffic signs
27%
Trajectories
13%
Uncertainty
13%
Mathematik
3D Reconstruction
11%
Computational Cost
7%
Defects
21%
Evaluation
5%
Heat
6%
Heat Conduction
7%
Heat Flow
25%
Imaging
15%
Irreversible Processes
10%
Lateral
23%
Learning
19%
Model
6%
Nonnegativity
7%
Propagation
6%
Sparsity
7%
Spatial Resolution
11%
Tomography
25%