Ingenieurwesen & Materialwissenschaft
3D printers
36%
Acoustic impedance
7%
Acoustic surface wave devices
26%
Acoustic waves
77%
Acoustics
11%
Actuators
12%
Adhesive pastes
8%
Adhesives
35%
Antennas
23%
Atomic force microscopy
7%
Bone
11%
Carrier concentration
8%
Characterization (materials science)
10%
Communication
6%
Copper
21%
Costs
12%
Crystals
8%
Curing
23%
Data communication systems
9%
Diaphragms
7%
Durability
9%
Electric delay lines
15%
Electric potential
6%
Electrohydrodynamics
33%
Electronic equipment
43%
Electronic paper
13%
Encapsulation
13%
End effectors
13%
Fabrication
37%
Fibers
8%
Film growth
9%
Frequency response
8%
Gallium
23%
Gases
14%
Grippers
14%
Hearing aids
16%
High temperature applications
23%
Hydrodynamics
10%
Impurities
5%
Industrial applications
6%
Ink
17%
Lasers
8%
Lead zirconate titanate
7%
Lighting
6%
Lithography
5%
Medical applications
13%
Membranes
6%
Metal foil
6%
Metallizing
14%
Metals
7%
Microstrip antennas
27%
Microstructure
8%
Monitoring
42%
Multilayers
21%
Nanoindentation
7%
Near field communication
61%
Nitrides
7%
Nozzles
10%
Packaging
23%
Paper coating
7%
Patents and inventions
14%
Permittivity
6%
Phase matching
6%
Phase velocity
8%
Photonics
7%
Photopolymers
6%
Phototransistors
19%
Plate metal
16%
Polymers
11%
Polypropylenes
25%
Predictive maintenance
15%
Pressure sensors
15%
Printing
72%
Production control
11%
Radio frequency identification (RFID)
33%
Rapid prototyping
7%
Resonators
25%
Seed
6%
Semiconductor materials
10%
Sensors
78%
Silver nanoparticles
17%
Smart textiles
5%
Soldering alloys
24%
Substrates
54%
Surface waves
95%
Temperature
49%
Temperature measurement
28%
Temperature sensors
45%
Thermal aging
7%
Thin films
11%
Topography
13%
Transducers
5%
Transmission electron microscopy
6%
Transponders
38%
Ultrasonics
14%
Water
6%
Wire
7%
Wireless sensor networks
9%
X ray diffraction
6%
Yttrium
8%
Physik & Astronomy
acoustics
58%
actuation
8%
adhesion
10%
adhesives
44%
amplifier design
9%
antennas
10%
assemblies
8%
assembly
14%
bolometers
7%
cathodes
7%
cavities
7%
cells
7%
ceramics
17%
characterization
14%
chips
100%
chutes
10%
coatings
7%
copper
12%
costs
10%
crystals
8%
curing
13%
cycles
13%
delay lines
18%
electronics
27%
ellipsometry
12%
emerging
7%
end effectors
19%
etching
9%
eutectics
14%
evaluation
15%
fabrication
10%
gallium
12%
gallium nitrides
19%
gases
9%
glass
24%
gold
8%
gyroscopes
13%
high electron mobility transistors
10%
igniters
9%
ignition
11%
ignition systems
9%
impedance
12%
industries
7%
laser-induced breakdown spectroscopy
15%
manufacturing
10%
masks
10%
mechanical properties
9%
membranes
18%
metal oxides
11%
methodology
14%
microelectromechanical systems
31%
microelectronics
12%
microstructure
16%
modules
12%
nuclear magnetic resonance
7%
oscillations
7%
packaging
38%
performance
32%
photometers
10%
pixels
9%
polyethylene terephthalate
13%
polymers
8%
polypropylene
12%
power lines
8%
power loss
7%
pressure sensors
13%
printing
10%
radio frequencies
26%
Rayleigh waves
14%
readout
22%
resonators
7%
sensors
52%
silicon
40%
silicon nitrides
12%
silver
10%
simulation
17%
sintering
9%
slags
7%
solar cells
6%
solders
44%
solid solutions
10%
surface acoustic wave devices
24%
systems-on-a-chip
9%
tellurides
16%
temperature
41%
temperature measurement
11%
temperature sensors
58%
thermal simulation
9%
thermistors
7%
thin films
15%
transducers
33%
transistors
9%
transition metals
10%
vacuum
7%
vapors
9%
wafers
34%
wall temperature
7%
wavelengths
9%
YAG lasers
11%
yttrium
7%