Original language | English |
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Title of host publication | Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 |
DOIs | |
Publication status | Published - 2014 |
Thickness dependency of adhesion properties of TiW thin films
A. Roshanghias, R. Pelzer, G. Khatibi, J. Steinbrenner
Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review