Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

A. Roshanghias, G. Khatibi, A. Yakymovych, J. Bernardi, H. Ipser

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Journal of Electronic Materials
DOIs	https://doi.org/10.1007/s11664-016-4584-4
Publication status	Published - 2016

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TY - JOUR

T1 - Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

AU - Roshanghias, A.

AU - Khatibi, G.

AU - Yakymovych, A.

AU - Bernardi, J.

AU - Ipser, H.

PY - 2016

Y1 - 2016

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84968542440&partnerID=MN8TOARS

U2 - 10.1007/s11664-016-4584-4

DO - 10.1007/s11664-016-4584-4

M3 - Article

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

ER -