Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation

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@inproceedings{16686d311aa24ea2830f142068a1607d,

title = "Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation",

author = "T. Arnold and J. Schicker and M. Kraft and C. Hirschl",

year = "2017",

doi = "10.1109/ICSENS.2016.7808808",

language = "English",

isbn = "21689229 19300395",

booktitle = "Proceedings of IEEE Sensors",

}

TY - GEN

T1 - Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation

AU - Arnold, T.

AU - Schicker, J.

AU - Kraft, M.

AU - Hirschl, C.

PY - 2017

Y1 - 2017

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85010931749&partnerID=MN8TOARS

U2 - 10.1109/ICSENS.2016.7808808

DO - 10.1109/ICSENS.2016.7808808

M3 - Conference Paper

SN - 21689229 19300395

BT - Proceedings of IEEE Sensors

ER -