| Original language | English |
|---|---|
| Title of host publication | 2020 IEEE 6th World Forum on Internet of Things (WF-IoT) |
| DOIs | |
| Publication status | Published - 2020 |
| Externally published | Yes |
Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications
Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review