LiNbO3 die-attach with Au-Ge eutectic solders

Ali Roshanghias; Gudrun Bruckner; Alfred Binder

doi:10.1109/icsj.2016.7801255

LiNbO3 die-attach with Au-Ge eutectic solders

Ali Roshanghias, Gudrun Bruckner, Alfred Binder

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Abstract

Lithium niobate (LiNbO3) single crystals are used as a promising piezoelectric material for high temperature sensors owing to its superior electromechanical coefficients and high frequency operation. The selection of materials and techniques for LiNbO3 die-Attach aiming for the service temperature up to 300 °C encounters many objectives and practical considerations, where the processing temperature should be kept below 450 °C due to the decomposition of the die. Among the few candidates of lead-free solders exist in this temperature range, gold-germanium (Au-12 wt. % Ge) eutectic solder has shown promising characteristics. Therefore, in the current study, LiNbO3 die-Attach to Hastelloy substrate with this solder was investigated. The mechanical properties of the corresponding assemblies were examined by a die-shear tester and the reliability of the joints has been assessed after thermal aging and thermal shock treatments at 300 °C.

Original language	English
Title of host publication	2016 IEEE CPMT Symposium Japan, ICSJ 2016
Pages	181-184
Number of pages	4
DOIs	https://doi.org/10.1109/icsj.2016.7801255
Publication status	Published - 1 Nov 2016

Publication series

Name	2016 IEEE CPMT Symposium Japan, ICSJ 2016

Keywords

Au-Ge
LiNbO3
die-Attach
eutectic bonding
packaging

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10.1109/icsj.2016.7801255

Cite this

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title = "LiNbO3 die-attach with Au-Ge eutectic solders",

abstract = "Lithium niobate (LiNbO3) single crystals are used as a promising piezoelectric material for high temperature sensors owing to its superior electromechanical coefficients and high frequency operation. The selection of materials and techniques for LiNbO3 die-Attach aiming for the service temperature up to 300 °C encounters many objectives and practical considerations, where the processing temperature should be kept below 450 °C due to the decomposition of the die. Among the few candidates of lead-free solders exist in this temperature range, gold-germanium (Au-12 wt. % Ge) eutectic solder has shown promising characteristics. Therefore, in the current study, LiNbO3 die-Attach to Hastelloy substrate with this solder was investigated. The mechanical properties of the corresponding assemblies were examined by a die-shear tester and the reliability of the joints has been assessed after thermal aging and thermal shock treatments at 300 °C.",

keywords = "Au-Ge, LiNbO3, die-Attach, eutectic bonding, packaging",

author = "Ali Roshanghias and Gudrun Bruckner and Alfred Binder",

year = "2016",

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doi = "10.1109/icsj.2016.7801255",

language = "English",

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series = "2016 IEEE CPMT Symposium Japan, ICSJ 2016",

pages = "181--184",

booktitle = "2016 IEEE CPMT Symposium Japan, ICSJ 2016",

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TY - GEN

T1 - LiNbO3 die-attach with Au-Ge eutectic solders

AU - Roshanghias, Ali

AU - Bruckner, Gudrun

AU - Binder, Alfred

PY - 2016/11/1

Y1 - 2016/11/1

N2 - Lithium niobate (LiNbO3) single crystals are used as a promising piezoelectric material for high temperature sensors owing to its superior electromechanical coefficients and high frequency operation. The selection of materials and techniques for LiNbO3 die-Attach aiming for the service temperature up to 300 °C encounters many objectives and practical considerations, where the processing temperature should be kept below 450 °C due to the decomposition of the die. Among the few candidates of lead-free solders exist in this temperature range, gold-germanium (Au-12 wt. % Ge) eutectic solder has shown promising characteristics. Therefore, in the current study, LiNbO3 die-Attach to Hastelloy substrate with this solder was investigated. The mechanical properties of the corresponding assemblies were examined by a die-shear tester and the reliability of the joints has been assessed after thermal aging and thermal shock treatments at 300 °C.

AB - Lithium niobate (LiNbO3) single crystals are used as a promising piezoelectric material for high temperature sensors owing to its superior electromechanical coefficients and high frequency operation. The selection of materials and techniques for LiNbO3 die-Attach aiming for the service temperature up to 300 °C encounters many objectives and practical considerations, where the processing temperature should be kept below 450 °C due to the decomposition of the die. Among the few candidates of lead-free solders exist in this temperature range, gold-germanium (Au-12 wt. % Ge) eutectic solder has shown promising characteristics. Therefore, in the current study, LiNbO3 die-Attach to Hastelloy substrate with this solder was investigated. The mechanical properties of the corresponding assemblies were examined by a die-shear tester and the reliability of the joints has been assessed after thermal aging and thermal shock treatments at 300 °C.

KW - Au-Ge

KW - LiNbO3

KW - die-Attach

KW - eutectic bonding

KW - packaging

UR - https://www.mendeley.com/catalogue/9e0a09f9-0573-3892-a92c-0fdd22923b78/

U2 - 10.1109/icsj.2016.7801255

DO - 10.1109/icsj.2016.7801255

M3 - Conference Paper

SN - 9781509020379

T3 - 2016 IEEE CPMT Symposium Japan, ICSJ 2016

SP - 181

EP - 184

BT - 2016 IEEE CPMT Symposium Japan, ICSJ 2016

ER -

LiNbO3 die-attach with Au-Ge eutectic solders

Abstract

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Keywords

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