Keep it cool! Optimize the thermal management of magnetic components in power electronics applications

Compact design with high power density has been a growing demand over the
years. High switching frequency is the prevailing method for generating high power density and it leads to reducing the passive component size as well. But increasing frequency in magnetic components can result in high conductor losses. This is due to the skin and the proximity effect inside the conductor. This issue can be mitigated by the planar transformer with thin and wide conductors of printed circuit board, that reduces leakage inductance and decreases alternating current resistance in the windings. Planar magnetic are extensively utilized in modern electronics applications such as high frequency switch mode power supply and hybrid power converters, either as independent components or integrated into the printed circuit board because of advantages they offer over conventional wire wound technology. Multiple studies have been conducted in terms of electrical and magnetic design. Thermal design is not well investigated and resulting in lack of information for accurately predicting the temperature in both the core and the windings of planar transformer. Thermal management is an important aspect to gain more compact and efficient system designs in power electronics applications. In this thesis, thermal management strategies with optimized cooling concepts and simulation of planar transformers for a given automotive onboard charger concept are discussed. Different thermal interface materials with good thermal conductivity for efficient heat transformation between solid bodies are investigated. A comparison study with simulation results is followed by the 1d analytical modelling.