Hybrid Integration of fine-pitch bare dies on polypropylene-coated paper substrates without using any adhesives or solders

Augusto Daniel Rodrigues, Thomas Weissbach, Muhammad Hassan Malik, Wolfgang Schmidt, Rainer Gumbiowski, Arved C. Hübler, Alfred Binder, Ali Roshanghias

Research output: Contribution to conference (No Proceedings)Poster

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Engineering & Materials Science