Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers

Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review

Original language	Undefined/Unknown
Title of host publication	XXXV EUROSENSORS Conference
Publisher	MDPI AG
DOIs	https://doi.org/10.3390/proceedings2024097153
Publication status	Published - 7 Apr 2024

Access to Document

@inproceedings{f03494a1cf0943ab8775f7a7a6ce93c4,

title = "Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers",

author = "Malik, \{Muhammad Hassan\} and Muhammad Khan and Sherjeel Khan and Ali Roshanghias",

year = "2024",

month = apr,

day = "7",

doi = "10.3390/proceedings2024097153",

language = "undefiniert/unbekannt",

booktitle = "XXXV EUROSENSORS Conference",

publisher = "MDPI AG",

address = "Schweiz",

}

TY - GEN

T1 - Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers

AU - Malik, Muhammad Hassan

AU - Khan, Muhammad

AU - Khan, Sherjeel

AU - Roshanghias, Ali

PY - 2024/4/7

Y1 - 2024/4/7

UR - https://doi.org/10.3390/proceedings2024097153

U2 - 10.3390/proceedings2024097153

DO - 10.3390/proceedings2024097153

M3 - Konferenzartikel

BT - XXXV EUROSENSORS Conference

PB - MDPI AG

ER -