Avoiding blister defects in low-stress hydrogenated amorphous silicon films for MEMS sensors

Lixiang Wu

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Sensors and Actuators A: Physical
DOIs	https://doi.org/10.1016/j.sna.2018.04.021
Publication status	Published - Jun 2018
Externally published	Yes

Access to Document

TY - JOUR

T1 - Avoiding blister defects in low-stress hydrogenated amorphous silicon films for MEMS sensors

AU - Wu, Lixiang

PY - 2018/6

Y1 - 2018/6

UR - http://dx.doi.org/10.1016/j.sna.2018.04.021

U2 - 10.1016/j.sna.2018.04.021

DO - 10.1016/j.sna.2018.04.021

M3 - Article

SN - 0924-4247

JO - Sensors and Actuators A: Physical

JF - Sensors and Actuators A: Physical

ER -