Advanced 2.5D PCB Based MEMS Package

M. Lenzhofer; A. Tortschanoff

Advanced 2.5D PCB Based MEMS Package

Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review

Original language	Undefined/Unknown
Title of host publication	Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015
Publication status	Published - 2015

Cite this

@inproceedings{3f61045ba1cb44cb8d3e3de6c3aba43d,

title = "Advanced 2.5D PCB Based MEMS Package",

author = "M. Lenzhofer and A. Tortschanoff",

year = "2015",

language = "undefiniert/unbekannt",

booktitle = "Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015",

}

TY - GEN

T1 - Advanced 2.5D PCB Based MEMS Package

AU - Lenzhofer, M.

AU - Tortschanoff, A.

PY - 2015

Y1 - 2015

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84976308214&partnerID=MN8TOARS

M3 - Konferenzartikel

BT - Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015

ER -

Advanced 2.5D PCB Based MEMS Package

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