| Original language | English |
|---|---|
| Pages (from-to) | 230 - 233 |
| Journal | International Journal of Computer and Electronics Research |
| Volume | 2014 |
| Issue number | 5 |
| Publication status | Published - Oct 2014 |
A New Design Approach for an Advanced Smart 2.5D PCB Based MEMS System-in-Package Solution
Research output: Contribution to journal › Article › peer-review