Abstract
A kind of beam groove combines step island film micro-pressure sensor chip and preparation method, chip includes the thin film in the middle part of substrate, four shallow slots are distributed along thin film top edge, four embossment beam is arranged between adjacent two shallow slot ends and is connected with substrate, the upper surface of embossment beam, the upper surface of thin film constitute beam groove with the bottom surface of shallow slot and are combined step membrane structure, four varistor bars are arranged on four embossment beams, varistor bar is connected into semi-loop Wheatstone bridge by metal lead wire, and the outfan of electric bridge is connected with pad；Four projections are uniformly distributed along thin film lower edge, and are connected with substrate；Four are separated with distance between mass and projection, projection is connected on thin film, and preparation method is that soi wafer high-temperature oxydation is made varistor bar, obtain ohmic contact regions and make metal lead wire and pad；Then four embossment beams and shallow slot are made, finally backside of substrate is bonded with antioverloading glass, the present invention has the features such as sensitivity is high, the linearity is good.
| Translated title of the contribution | A kind of beam groove combines step island film micro-pressure sensor chip and preparation method |
|---|---|
| Original language | Chinese (Simplified) |
| Patent number | CN104729784B |
| Publication status | Published - 2015 |