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(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors
Moridi, Mohssen
(PI)
Overview
Research output
(1)
Project Details
Acronym
SILENSE
Status
Finished
Effective start/end date
1/05/17
→
30/04/20
Collaborative partners
NXP Semiconductors
(lead)
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Research output
Research output per year
2020
2020
2020
1
Article
Research output per year
Research output per year
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, A.
,
Dreissigacker, M.
,
Scherf, C.
,
Bretthauer, C.
,
Rauter, L.
,
Zikulnig, J.
,
Braun, T.
,
Becker, K-F.
,
Rzepka, S.
&
Schneider-Ramelow, M.
,
31 May 2020
,
In:
Micromachines.
Research output
:
Contribution to journal
›
Article
›
peer-review