(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors

Moridi, Mohssen (PI)

Acronym	SILENSE
Status	Finished
Effective start/end date	1/05/17 → 30/04/20

Collaborative partners

NXP Semiconductors (lead)

1 Article

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, A., Dreissigacker, M., Scherf, C., Bretthauer, C., Rauter, L., Zikulnig, J., Braun, T., Becker, K-F., Rzepka, S. & Schneider-Ramelow, M., 31 May 2020, In: Micromachines.
Research output: Contribution to journal › Article › peer-review