Innovative Network for Training in wAter and Food QUality monitoring using Autonomous SENSors and IntelligEnt Data Gathering and Analysis

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2022

Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S. & Roshanghias, A., 8 Mar 2022, In: Electronics.
Research output: Contribution to journal › Article › peer-review
2021
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
Malik, M. H., Grosso, G., Zangl, H., Binder, A. & Roshanghias, A., 1 Aug 2021, In: Microelectronics Reliability. 123, p. 114204
Research output: Contribution to journal › Article › peer-review

Open Access

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