Research output per year
Research output per year
Project Details
| Acronym | AQUASENSE |
|---|---|
| Status | Finished |
| Effective start/end date | 1/10/18 → 30/06/23 |
Collaborative partners
- University of Glasgow (lead)
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
-
Integration and Packaging for Water Monitoring Systems
Malik, M. H. & Roshanghias, A., 31 Aug 2023, Sensing Technologies for Real Time Monitoring of Water Quality. Hoboken, New Jersey, p. 161 184 p.Research output: Conference proceeding/Chapter in Book/Report/ › Chapter › peer-review
-
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S. & Roshanghias, A., 8 Mar 2022, In: Electronics.Research output: Contribution to journal › Article › peer-review
-
Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
Malik, M. H., Rauter, L., Zangl, H., Binder, A. & Roshanghias, A., 30 Jun 2022, Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers. p. 1-4Research output: Conference proceeding/Chapter in Book/Report/ › Conference Paper › peer-review
Open Access -
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
Malik, M. H., Grosso, G., Zangl, H., Binder, A. & Roshanghias, A., 1 Aug 2021, In: Microelectronics Reliability. 123, p. 114204Research output: Contribution to journal › Article › peer-review
Open Access