Skip to main navigation
Skip to search
Skip to main content
Silicon Austria Labs Home
English
Deutsch
Home
Profiles
Research Units
Projects
Research output
Prizes
Activities
Courses
Impacts
Search by expertise, name or affiliation
Innovative Network for Training in wAter and Food QUality monitoring using Autonomous SENSors and IntelligEnt Data Gathering and Analysis
Roshanghias, Ali
(PI)
Heterogeneous Integration Technologies (HIT)
Overview
Fingerprint
Research output
(2)
Project Details
Acronym
AQUASENSE
Status
Active
Effective start/end date
1/10/18
→
30/06/23
View all
View less
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
Encapsulation
Engineering & Materials Science
100%
Foil
Chemical Compounds
88%
adhesives
Physics & Astronomy
86%
Adhesives
Engineering & Materials Science
79%
Electronic equipment
Engineering & Materials Science
74%
Flexibility
Chemical Compounds
70%
chips
Physics & Astronomy
69%
electronics
Physics & Astronomy
45%
Research output
Research output per year
2021
2021
2022
2022
2
Article
Research output per year
Research output per year
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Malik, M. H.
,
Tsiamis, A.
,
Zangl, H.
,
Binder, A.
,
Mitra, S.
&
Roshanghias, A.
,
8 Mar 2022
,
In:
Electronics.
Research output
:
Contribution to journal
›
Article
›
peer-review
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
Malik, M. H.
,
Grosso, G.
,
Zangl, H.
,
Binder, A.
&
Roshanghias, A.
,
1 Aug 2021
,
In:
Microelectronics Reliability.
123
,
p. 114204
Research output
:
Contribution to journal
›
Article
›
peer-review
Open Access
Encapsulation
100%
Foil
88%
adhesives
86%
Adhesives
79%
Electronic equipment
74%